iPhone 18's Advanced A20 Chip Packaging Gains Momentum at TSMC

Jun 23, 2025 - 09:00
iPhone 18's Advanced A20 Chip Packaging Gains Momentum at TSMC
Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly already established a dedicated production line for Apple >>>

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Fonte: MacRumors (Continue lendo)